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MIDASoft
By
July 23, 2018

PC board thermal stress analysis

 

 

 

Detail of this Session
Heat Transfer/Heat Stress Analysis

NFX 2012 offers practical heat transfer and heat stress analysis capabilities. Especially heat stress analysis is provided as an independent analysis case. As such, a single analysis can produce temperature results by heat transfer and thermal deformation/thermal stress results.


Steady and transient heat transfer analyses
Nonlinear heat transfer analysis function considering temperature-dependent materials and conditions

Various load conditions
- Heat generation, conduction, convection, radiation, heat flux, initial temperature, fixed temperature conditions

Thermal contact function to simulate heat conduction between discontinuous parts
Heat transfer analysis function considering cavity radiation
- Open/closed conditions
- Radiation shape factor calculation
Effective transient heat transfer analysis using sensor
- Automatic termination of analysis based on standards
- Minimum/maximum/average temperatures in a selected domain defined under the sensor conditions

 





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